锡条: SOLDE BAR
锡膏: SOLDER PASTE
锡炉: SOLDER-POT
浸锡: DIG-SOLDER
焊点: SOLDERING JOINTS
焊盘: PAD/LAND
焊接: WELDING
超声波焊接: ULTRASONIC WELDING
回流焊接: REFLOW SOLDERING
波峰焊接: WAVE SOLDERING
回焊前: PRE-REFLOW
回焊后: POST-REFLOW
回流炉: REFLOW OVEN
虚焊: DEWETTING
假焊: SHORT SOLDER
少锡: INSUFFICENT SOLDER
偏位: MISALIGNMENT
阻焊剂: SOLDER-THIEF/MASK
线路: TRACE
回路: CIRCUIT
短路: BRIGING/SHORT
线路开路: BROKEN TRACE
线路板; PCB(Printed Circuit Board)
线路板装配: PCBA( PRINTED CIRCUIT BOARD ASSEMBLY)
集成电路:IC( INTERGRATED CIRCUIT)
ESD: ELECTROSTATIC DISCHARGE: 静电放电
ESD PREVENTION&DAMAGE: 静电防护与损坏
FMEA: FAILURE MODE AND EFFECT ANALYSIS(失效模式分析)
SPC: STASTICAL PROCESS CONTROL(统计过程控制)
IPC: INSTITUTE OF PACKING AND INTERCONNECTS(电子电路互连与封装协会)
正极: ANODE END
负极: CATHODE END
硬化: CURING
配线: WIRING
冷却硬化: OVEN-CURING
间距: PITCH
周期: CIRCLE TIME
测试: DEBUG
模拟: SIMULATION
毛细管现象: CAPILLARY ACTION
导体: CONDUCTIVE PATTERN
介质材料: DIELETRIC MATERIAL
镀通孔: PTH( PLATED THROUGH HOLE)
额定电源: RATED POWER
氧化: OXIDE
烘干: BAKE
紫外线: ULTRAVIOLET
线圈: WINDING
涂层: COATING
溶剂: SOVENT
隔热板: FELT
不合格品: NONCONFIRMING UNITS
原料: DIRECT MATERIAL
辅料: INDIRECT MATERIAL
试产: PILOT PRODUCTION
量产: MASS PRODUCTION
X 光测试: X RAY TEST
跌打测试: DROP TEST
老化测试: BURN-IN TEST
振动测试: VIBRATION TEST
丝印: SPRAY-PAITING
烫金: METAL-STAMPING
注塑: INJECTION MOLDING
